There are some of that just not content to leave things as they are, no matter what the item or device is we just can't help ourselves because we feel we are capable of either increasing the power (if it happens to be an automobile) or increase the speed if it happens to be a computer. Whether it be a car or computer the one thing they have in common is as you increase the power or speed of either item it will also increase the heat that is generated as you attempt to better the performance of either item.
In automobiles the choices you have a pretty limited, you can increase the size of the radiator or perhaps mount a second one side-by-side to help reduce the heat. In computers you can go for a larger heatsink, add more fans to your case, opt for water cooling put if the room your system is located in is hot the water cooling system will work no better than the air cooled system. Then there is the method that CoolerMaster has come up with and that is to combine air cooling with heatpipes and then add a TEC Thermal-Electrical Cooler to the the heatsink and you have yourself a very competent cooling apparatus.
Features
Optimal Cooling Technology
Unique triple heat sink design for supreme cooling performance
10 heat pipes (6 for main body; 4 for TEC) maximize heat transfer
Dual PWM fan ensures huge airflow over the heat sinks
Unique Triple Heat Sink with Modular AI. Fins
Dual PWM Fans
Full coverage of DRAM & CPU for best cooling performance
Full Coverage Cooling (DRAM & CPU)
Hybrid TEC Solution
TEC is intelligently activated once CPU reaches extreme temperatures
Main Unit with TEC
Specifications
Model
RR-B2P-UV10-GP
CPU Socket
Intel LGA1366 & 775, AMD 754/939/940/AM2
Dimension
(L) 9.32 x (W) 5.11 x (H) 6.36 inches or (L) 236.5 x (W) 129.6 x (H) 161.3 mm
Weight
2.65 lbs
Heat Sink Material
Cu base, AL fin, 10 heatpipes
Heat Pipes Dimensions
6mm
Fan Dimension
(L) 4.73 x (W) 1.00 x (H) 4.73 inches or (L) 120 x (W) 25 x (H) 120 mm